High Efficiency Clapboard-Free Filter

Product Characteristics

Excellent V-shaped bend design, low resistance, and low energy consumption.

Compact structure, easy to install and replace.

100% low-chemical composition materials.

Leak detection ensures no leakage upon delivery; efficiency testing strictly adheres to EN1822 standards.

Purpose And Method

Semiconductor chip packaging workshop: Internal filtration of the clean bench utilizes 38mm thick H14-grade barrier-free HEPA filters, adaptable to narrow air ducts (width ≤100mm), intercepting over 99.995% of 0.3μm particles, ensuring pin soldering precision during chip packaging;

PCB flexible printed circuit board (FPC) processing: Exhaust gas filtration from laser cutting equipment, ultra-thin barrier-free design (45mm thick) can be directly embedded in the side air duct of the equipment, intercepting 0.1μm resin dust, preventing dust adhesion to the FPC surface and causing short circuits;

Electronic component (e.g., transducer) assembly: End-of-line filtration in the clean booth, barrier-free HEPA filters are lightweight (≤5kg per square meter), can be directly suspended from the top of the ladder, reducing the load on the equipment while meeting dry-grade cleanliness requirements.

Product Efficiency

Based on EN1822 efficiency levels:

H13-99.95@MPPS H14–99.995MPPS U15–99.95@MPPSU16–99.95@MPPS U17—99.95@MPPS

Curve Of Initial Resistance-Air Volume Relationship

Technical Indicators

– H13 grade: ≥99.95% (≥0.3μm)
– H13 grade: MPPS=0.15-0.25μm, efficiency ≥99.95%

– H14 grade: ≥99.995% (≥0.3μm)
– H14 grade: MPPS=0.2-0.3μm, efficiency ≥99.995%

– Short fine glass fiber filter media: 250-350g/m²

· Synthetic fiber filter media: 200-300g/m²

Performance Parameter